12th Edition - Iasi ROMANIA

Education, Research, Deveplopment and Manufacturing

of Electronic Packages

September 21-24, Iasi, Romania

 

 

 

 

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Primary Objective of the Seminar is to provide an international forum for disemination of information and scientific results relating to education, research and development activity. It is a tradition for all participans of the seminar to present paper(s) which are published in the Proceedings.

Major topics:
 ๐ electronic components and packaging (SMD, uBGA, CSP, FC);
 ๐ electronic and optoelectronic modules manufacturing (SMT/PCB/ MCM);
 ๐ printing wiring board - materials, processing, process simulation and application;
 ๐ electromagnetic compatibility and signal integrity analysis; electrostatic discharge;
 ๐ reliability of new packaging concepts interconnection technology;
 ๐ optical investigation; in circuit-test systems;
 ๐ sensor technologies and measurement systems;
 ๐ power management in electronic modules;
 ๐ embedded systems;
 ๐ thermal management, reliability and life time prediction;
 ๐ quality management: Q- assurance, Q- control, Q- inspection;CAE - CAD - CAM for electronic packages and modules; modeling and simulation;
 ๐ design for environment and environmentally conscious manufacturing; clean technologies;
 ๐ concurrent engineering and project management on electronic packages;
 ๐ networking and Internet education;

Seminar fee: 150 EURO Fee includes plenary and panel sessions attendance, conference materials, hotel accommodation for 3 nights, full day board, coffee breaks and trip.

Address:  Faculty of Electronics and Telecommunications, Bd. Carol I, no.11, Iasi, 700506, Romania

Tel: +40 232 213 737 / 112

       +40 232 213 737 / 136

Fax: +40 232 217 720

 

Ministry of Education and Research

 

Romanian Association for Electronics Industry and Software

 

Association for Promoting Electronic Technology

 

IEEE Romania Section

2005 Faculty of Electronics and Telecommunications Iasi