12th Edition - Iasi ROMANIA

Education, Research, Deveplopment and Manufacturing

of Electronic Packages

September 21-24, Iasi, Romania







Call for papers


Steering Committee










Primary Objective of the Seminar is to provide an international forum for disemination of information and scientific results relating to education, research and development activity. It is a tradition for all participans of the seminar to present paper(s) which are published in the Proceedings.

Major topics:
 ๐ electronic components and packaging (SMD, uBGA, CSP, FC);
 ๐ electronic and optoelectronic modules manufacturing (SMT/PCB/ MCM);
 ๐ printing wiring board - materials, processing, process simulation and application;
 ๐ electromagnetic compatibility and signal integrity analysis; electrostatic discharge;
 ๐ reliability of new packaging concepts interconnection technology;
 ๐ optical investigation; in circuit-test systems;
 ๐ sensor technologies and measurement systems;
 ๐ power management in electronic modules;
 ๐ embedded systems;
 ๐ thermal management, reliability and life time prediction;
 ๐ quality management: Q- assurance, Q- control, Q- inspection;CAE - CAD - CAM for electronic packages and modules; modeling and simulation;
 ๐ design for environment and environmentally conscious manufacturing; clean technologies;
 ๐ concurrent engineering and project management on electronic packages;
 ๐ networking and Internet education;

Seminar fee: 150 EURO Fee includes plenary and panel sessions attendance, conference materials, hotel accommodation for 3 nights, full day board, coffee breaks and trip.

Address:  Faculty of Electronics and Telecommunications, Bd. Carol I, no.11, Iasi, 700506, Romania

Tel: +40 232 213 737 / 112

       +40 232 213 737 / 136

Fax: +40 232 217 720


Ministry of Education and Research


Romanian Association for Electronics Industry and Software


Association for Promoting Electronic Technology


IEEE Romania Section

2005 Faculty of Electronics and Telecommunications Iasi